Module Introduction

          

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The SMARC Formfactor

The SMARC (“Smart Mobility ARChitecture”) is a versatile small form factor computer on Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W.

Two Module sizes are defined: 82 mm x 50 mm and 82 mm x 80 mm.

The Module PCBs have 314 edge fingers that mate with a low profile 314 pin 0.5 mm pitch right angle connector (the connector is sometimes identified as a 321 pin connector, but 7 pins are lost to the key).

The Modules are used as building blocks for portable and stationary embedded systems. The core CPU and support circuits, including DRAM, boot flash, power sequencing, CPU power supplies, GBE and a single channel LVDS display transmitter are concentrated on the Module. The Modules are used with application specific Carrier Boards that implement other features such as audio CODECs, touch controllers, wireless devices, etc. The modular approach allows scalability, fast time to market and upgradability while still maintaining low costs, low power and small physical size.

SMARC module and carrier specifications are

module and carrier specifications are
available online at : https://www.sget.org/standards/smarc.html

Specifications

Core System

SoC

NXP i.MX8M Plus with Quad core ARM Cortex-A53
TrustZone technology supports ARMv8 Cryptography Extensions
2.3 TOPS Neural Processing Unit (optional)

Memory

2/4/8GB LPDDR4L-4266

L2 Cache

512KB system L2 cache (ECC)

Security

Resource Domain Controller (RDC) supports 4 domains and up to 8 regions of DDR
Arm® TrustZone® (TZ) architecture: Cortex®-A53 MPCore TrustZone® support
On-chip RAM (OCRAM) secure region protection using OCRAM controller
High Assurance Boot (HAB)
Cryptographic Acceleration and Assurance Module (CAAM)
Capable to support Widevine and PlayReady content protection
Public Key Cryptography (PKHA) with RSA and Elliptic Curve (ECC) algorithms
Real-time integrity checker (RTIC)
DRM support for RSA, AES, 3DES, DES
Side channel attack resistance
True random number generation (RNG)
Manufacturing protection support / Secure Non-Volatile Storage (SNVS)

TPM
​ Optional TPM 2.0 security

MIPI-DSI
1x MIPI-DSI 4 lanes
Cameras
MIPI-CSI RX Interface
Compatible with the MIPI Alliance Interface specification v1.0
Up to 4 data lanes, 1.0Gbps maximum data rate per lane
Supports MIPI-HS, MIPI-LP mode
1x MIPI-CSI dual lane interface
1x MIPI-CSI quad lane interface

Video

GPU Core
Vivante GC7000UL
GPU Feature Support
GC7000UL (2 shaders), OpenGL ES 2.0/3.0/3.1, Vulkan,
OpenCL 1.2; GC380 (2D)

VPU Feature Support
1080p60 VP9 Profile 0, 2 (10 bit) decoder (Hantro G2),
input video stream can be 10-bit, the output decoded
video is always 8-bit after post-processing in G2 core
1080p60 HEVC/H.265 decoder (Hantro G2)
1080p60 AVC/H.264 Baseline, Main, High decoder (Hantro G1)
1080p60 VP8 decoder (Hantro G1)
The video encoding features include:
1080p60 AVC/H.264 Encoder
1080p60 HEVC/H.265 Encoder

NPU

2.3 TOP/s Neural Network performance

HDMI
HDMI 2.0a

MIPI DSI

DSI 4 lanes

LVDS

Dual Channel LVDS port 18/24 bit

Camera support

Compatible with the MIPI Alliance Interface specification v2.1

Two MIPI-CSI2 camera inputs, one 4-lane and one 2-lane

Audio

Audio Codec
I2S audio codec (located on carrier)

Dual Ethernet

Primary LAN

MAC 10/100/1000 Ethernet Controller on SoC (TSN capable)

Secondary LAN

MAC 10/100/1000 Ethernet Controller on SoC

Wireless Communication

Wi-Fi
IEEE 802.11 2X2 MIMO ac/a/b/g/n Wireless LAN

Bluetooth
Bluetooth 5.0 complaint with Bluetooth 2.1+Enhanced Data Rate (EDR)

Extension Busses

PCIe

2x PCIe x1 Gen2.1 *

USB

2x USB 3.0, 3x USB 2.0, 1x USB 2.0 OTG *

UART

Three UART interfaces SER1 and SER 2 (CTS/RTS) / SER0 (TX/RX/CTS/RTS)

CAN

2x CAN2.0B only or mixed CAN2.0B and CAN FD mode, data bit rate up to 8 Mbps

SPI

2x SPI

I²S

2x I²S interfaces with audio resolution from 16-bits to 32-bits and sample rate up to 192KHz (see Audio Codec support)

I²C
Four I²C interfaces

• Support for 7-bit and 10-bit address mode
• Software programmable clock frequency of 100 kbit/s in Standard-mode, 400 kbit/s in the Fast-mode or 1 Mbit/s in Fast-mode Plus

GPIO

14x GPIO with interrupt, one GPIO with PWM

System Storage

SDIO

1x SDIO (4-bit) compatible with SD/SDIO standard, up to version 3.0

eMMC

16, 32, 64 or 128 GB (build option)
Compatible with eMMC specifications 4.41, 4.51, 5.0 and 5.1

SEMA® Board Controller

Voltage/current monitoring, boot configuration, logistics and forensic

information, flat panel control, watchdog timer

Debug Header

30-pin multipurpose flat cable connector for use with optional DB-30 debug module

Provides JTAG, BMC access; UART, power test points; diagnostic LEDs, Power, Reset, Boot configuration

Power

Input

5Vdc +/- 5%

Mechanical and Environmental

Form Factor

SGET SMARC Specifications 2.1

Dimensions

SMARC short size module, 82mm x 50mm

Operating Temperature

Standard: 0°C to +60°C

Rugged: -20°C to +85°C (optional)

Humidity

5-90% RH operating, non-condensing

5-95% RH storage (and operating with conformal coating)

Shock and Vibration

IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202 F,

Method 213B, Table 213-I, Condition A and Method 214A,

Table 214-I, Condition D

HALT

Thermal Stress, Vibration Stress, Thermal Shock and Combined Test

Operating Systems

Standard Support

Yocto Linux BSP, Android

Extended Support (BSP)
VxWorks