LEC-IMX8MP SMARC 2.1.1 module with I-Pi SMARC Plus Carrier Board

Industrial Prototyping Kit for IoT/AIoT with Off-the-Shelf SMARC Computer-on-Module

SMARC 2.1.1 Carrier Board with M.2 Extension.

Download Datasheet

Features

Equipped with SMARC 2.1.1 compliant, specially designed for
industrial embedded applications requiring long life, high MTBF and
strict revision control
Includes everything needed to go live in minutes
Industrial grade quality and 15 year product availability
Supports Android, Ubuntu and Yocto OS

Specifications

Graphics and Camera

1x HDMI 1.4b / 2.0b

1x eDP 1.3 (bom option)

1x MIPI-DSI 4 lanes

1x MIPI-CSI dual lane interface

1x MIPI-CSI quad lane interface

Audio

Interchangeable audio codec connector with I2S and HDA signals

Dual Ethernet

1x 10/100/1000 RJ45 connector

Expansion Busses

2x USB 3.0, 2x USB 2.0, 1x USB 2.0 OTG connectors

4x UART interfaces SER2 (TX/X/CTS/RTS) and SER0, SER1, SER3 (TX/RX)

2x CAN 2 interface pin headers

2x SPI pin headers

1x I²S interface to audio interface

2x I²C interface on pin header

14x GPIO with interrupt on pin header

M.2 B-key and M.2 E-key expansion slots for additional storage or communication

Micro SD card slot

SIM card slot

Storage

1x SDIO (4-bit) compatible with SD/SDIO standard, up to version 3.0

Power

19Vdc input via barrel connector

Mechanical and Environmental

Form Factor: SGET SMARC Specifications 2.1

Dimensions: 110 mm x 110 mm

Operating Temperature:

Standard: 0°C to +60°C

Rugged: -40°C to +85°C (optional)

Humidity:

5-90% RH operating, non-condensing

5-95% RH storage (and operating with conformal coating)

Shock and Vibration:

IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202 F,

Method 213B, Table 213-I, Condition A and Method 214A,

Table 214-I, Condition D

HALT

Thermal Stress, Vibration Stress, Thermal Shock and Combined Test

Hexo