AVA Developer Platform

Server Type COM-HPC Size E Module with ARM-based Ampere Altra Processor

image-20210820112513464 COM-HPC-ALT_CPU-F

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Features

  • ARM-based architecture, up to 80 cores at 175W TDP

  • Up to 768GB DDR4 with 6 individual memory channels

  • Open source EDK II, seamless support for popular OS

  • 64 PCIe Gen4 lanes (3 x16 available)

  • PCIe x16 that can insert the GPU as AI accelerator

  • Dedicated PCIe and IPMB for remote management

Specifications

Core System

SoC

​ Ampere Computing, Ampere Altra Series Processors

​ • Q80-28 80 cores, 2.6(2.8)GHz, 175W TDP

​ • Q32-17 32 cores, 1.5(1,7)GHz, 58W TDP

​ Note: Additional SKUs are supported by project basis

Memory

​ Six DIMM sockets with individual memory channels

​ Up to 768GB (6x 128GB) DDR4 RDIMM memory, up to 3200MT/s

Embedded BIOS

​ Open Source EDK II

Expansion Busses

64 PCI Express Gen4 Lanes

  • 8 PCI Express Lanes 0-7 (J1): configurable to x8, x4, x2

  • 8 PCI Express Lanes 8-15 (J1): configurable to x8, x4, x2

  • 16 PCI Express Lanes 16-31 (J2): configurable to x16, x8, x4

  • 16 PCI Express Lanes 32-47 (J2): configurable to x16, x8, x4

  • 16 PCI Express Lanes 48-63 (J2): configurable to x16, x8, x4

    Note: PCIe x16 that can insert the selected GPU as AI accelerator

SMBus (system), 2x I2C (user), GP_SPI


Module Management Controller

  • IPMB (for communication with carrier BMC)

  • Voltage/current monitoring

  • Power sequence debug support

  • AT/ATX mode control

  • Board Information

  • Forensic information, watchdog timer, fan control


Debug Headers

40-pin multipurpose flat cable connector for use with DB40-HPC debug module providing:

  • BIOS POST code LED
  • MMC/EC access
  • SPI BIOS flashing
  • Power testpoints
  • Debug LEDs

Ethernet KR

MAC

​ External LAN controller

Interface

​ Up to 4x 10GBASE-KR (TBC)

NBASE-T Ethernet

Intel MAC/PHY

​ Intel® Ethernet Controller I210

Interface

​ 10/100/1000 Mbit/s Ethernet connection

Remote Management Dedicated Interfaces

PCIe_BMC

​ Dedicated PCIe for carrier BMC, mainly used for KVM (carrier BMC emulates
​ graphics card) (TBC)

IPMB

​ Provided by MMC, dedicated connection between carrier BMC and module
​ MMC (TBC)

Multi I/O and Storage

USB

​ 4x USB 3.0/2.0/1.1 (USB 0,1,2,3)

Serial

​ 2x UART ports with console redirection

GPIO

​ 12x GPIO (GPI with interrupt TBC)

TPM

Chipset

​ Infineon

Type

​ TPM 2.0 (SPI based)

Power

Standard Input

​ ATX: 12V±5% / 5Vsb ±5%; or AT: 12V±5%

Management

​ ACPI 5.0 compliant

Power States

​ S0, S5

Mechanical and Environmental

Form Factor

​ PICMG COM-HPC: Rev 1.0 Server Type

Dimension

​ Size E: 200 mm x 160 mm

Operating Temperature

​ Standard: 0°C to 60°C (storage: -20°C to 80°C)

Humidity

​ 5-90% RH operating, non-condensing

​ 5-95% RH storage (and operating with conformal coating)

Shock and Vibration

​ IEC 60068-2-64 and IEC-60068-2-27

​ MIL-STD-202F Method 213B, Table 213-I, Condition A and Method 214A,

​ Table 214-I, Condition D (TBC)

HALT

​ Thermal Stress, Vibration Stress, Thermal Shock and Combined Test

Operating Systems

Standard Support

​ Yocto Hardknott project based Linux 64-bit

​ Ubuntu Server for ARM - 20.04.3 LTS 64-bit

​ CentOS 8 Stream


Preliminary Functional diagram

image-20210808170652562

Note: Crossed out Interfaces are not supported on Module